US Patent 7615397 Micro-element package and manufacturing method thereof
Patent 7615397 was granted and assigned to Samsung on November, 2009 by the United States Patent and Trademark Office.
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A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.
US Patent 07615397 Micro-element package and manufacturing method thereof US Patent 7615397 Micro-element package and manufacturing method thereof
US Patent 07615397 Micro-element package and manufacturing method thereof
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