Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seth J. Prejean0
Roy Mark Miller0
Date of Patent
January 19, 2010
0Patent Application Number
111331080
Date Filed
May 19, 2005
0Patent Primary Examiner
Patent abstract
A structure and method is utilized to detect cracks, fissures, fractures, or other dislocations in an IC die. A conductive line in a metal layer is provided about the periphery of the IC die. A break in the conductive line indicates that the IC die is cracked. A JTAG interface can be utilized to provide an indication of whether the die is cracked.
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