Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 31, 2010
Patent Application Number
11225648
Date Filed
September 13, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A System In Package (SIP) arrangement and method of connecting a plurality of flip chips and wire bond chips with reduced wiring complexity and increase flexibility. The SIP arrangement includes at least one wire bond chip and at least one flip chip.
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