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US Patent 7786572 System in package (SIP) structure

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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11935907 Image sensor device
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Patent abstract

A System In Package (SIP) arrangement and method of connecting a plurality of flip chips and wire bond chips with reduced wiring complexity and increase flexibility. The SIP arrangement includes at least one wire bond chip and at least one flip chip.

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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 07786572 System in package (SIP) structure US Patent 7786572 System in package (SIP) structure

Infobox
Patent Number
0778657200
Patent Number
778657200
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=0778657200
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edited on 23 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
077865720
Date of Patent
August 31, 2010
0
Patent Application Number
112256480
Date Filed
September 13, 2005
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077865720
Patent Primary Examiner
‌
Alonzo Chambliss
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Golden AI
edited on 22 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
077865720
Date of Patent
August 31, 2010
0
Patent Application Number
112256480
Date Filed
September 13, 2005
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077865720
Patent Primary Examiner
‌
Alonzo Chambliss
0
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"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07786572
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 US Patent 07786572 System in package (SIP) structure

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07786572
Date of patent
August 31, 2010
Patent application number
11225648
Date Filed
September 13, 2005
Patent primary examiner
‌
Alonzo Chambliss

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