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US Patent 7918135 Pressure sensor including thermal selftest

Patent 7918135 was granted and assigned to Infineon Technologies on April, 2011 by the United States Patent and Trademark Office.

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Patent abstract

A semiconductor device includes a diaphragm, a sensing element, and a circuit. The sensing element is configured to sense deflection of the diaphragm. The circuit is configured to heat the diaphragm to induce deflection of the diaphragm.

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Patent Citations Received
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US Patent 11787688 Methods of forming MEMS diaphragms including corrugations
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Patent Citations Received
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US Patent 11780726 Dual-diaphragm assembly having center constraint
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Patent Citations Received
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US Patent 11772961 MEMS device with perimeter barometric relief pierce
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Patent Inventor Names
Dirk Hammerschmidt0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=079181350
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US Patent 07918135 Pressure sensor including thermal selftest US Patent 7918135 Pressure sensor including thermal selftest

Infobox
Patent Number
079181350
Patent Number
79181350
Edits on 28 Sep, 2022
"Entity importer update"
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Infobox
Is a
Patent
Patent
0
Current Assignee
Infineon Technologies
Infineon Technologies
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
079181350
Date of Patent
April 5, 2011
0
Patent Application Number
123648840
Date Filed
February 3, 2009
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=079181350
Patent Primary Examiner
‌
Jewel Thompson
0
Edits on 19 Jun, 2022
"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07918135
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 US Patent 07918135 Pressure sensor including thermal selftest

Infobox
Is a
Patent
Patent
Current assignee
Infineon Technologies
Infineon Technologies
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07918135
Date of patent
April 5, 2011
Patent application number
12364884
Date Filed
February 3, 2009
Patent primary examiner
‌
Jewel Thompson

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