Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 17, 2011
Patent Application Number
12201819
Date Filed
August 29, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
A MEMS structure having a stress-inducer temperature-compensated resonator member is described. The MEMS structure includes a frame disposed above a substrate. The frame has an inner surface and an outer surface and is composed of a first material having a first coefficient of thermal expansion (CTE) and a second material having a second CTE, different from the first CTE. A resonator member is coupled to the inner surface of the frame.
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