US Patent 7944124 MEMS structure having a stress-inducer temperature-compensated resonator member

A MEMS structure having a stress-inducer temperature-compensated resonator member is described. The MEMS structure includes a frame disposed above a substrate. The frame has an inner surface and an outer surface and is composed of a first material having a first coefficient of thermal expansion (CTE) and a second material having a second CTE, different from the first CTE. A resonator member is coupled to the inner surface of the frame.