US Patent 7989029 Reduced porosity copper deposition
Patent 7989029 was granted and assigned to SRI International on August, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.
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Patent Inventor Names
Jaspreet Singh Dhau0
Sunity K. Sharma0
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US Patent 07989029 Reduced porosity copper deposition US Patent 7989029 Reduced porosity copper deposition
Infobox
Patent Number
079890290
Patent Number
79890290
Edits on 23 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079890290
Date of Patent
August 2, 2011
0Patent Application Number
121437370
Date Filed
June 20, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07989029 Reduced porosity copper deposition
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07989029
Date of patent
August 2, 2011
Patent application number
12143737
Date Filed
June 20, 2008
Patent primary examiner
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