US Patent 8034705 Method of forming a seam-free tungsten plug
Patent 8034705 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on October, 2011 by the United States Patent and Trademark Office.
Is a
Date Filed
July 16, 2009
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Date of Patent
October 11, 2011
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Patent Application Number
12460318
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Patent Citations Received
Patent Inventor Names
Yoon-Ho Son
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Chang-Ki Hong
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Ju-Young Jung
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Suk-Hun Choi
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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