Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michal Danek0
Raashina Humayun0
Sean Chang0
Aaron R. Fellis0
Anand Chadrashekar0
Date of Patent
February 21, 2012
0Patent Application Number
125354640
Date Filed
August 4, 2009
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods of filling high aspect ratio features provided on partially manufactured semiconductor substrates with tungsten-containing materials are provided. In certain embodiments, the methods include partial filling a high aspect ratio feature with a layer of tungsten-containing materials and selective removal of the partially filled materials from the feature cavity. Substrates processed using these methods have improved step coverage of the tungsten-containing materials filled into the high aspect ratio features and reduced seam sizes.
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