US Patent 8280479 Flexible 3D microprobe structure

Patent 8280479 was granted and assigned to National Tsing Hua University on October, 2012 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

National Tsing Hua University

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

82804790

Patent Inventor Names

Da-Jeng Yao0

Yen-Chung Chang0

Chang-Hsiao Chen0

Shih-Chang Chuang0

Date of Patent

October 2, 2012

Patent Application Number

126374850

Date Filed

December 14, 2009

Patent Citations Received

‌

US Patent 11957898 Implantable device for the brain

Patent Primary Examiner

‌

Linda Dvorak

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