US Patent 8280479 Flexible 3D microprobe structure
Patent 8280479 was granted and assigned to National Tsing Hua University on October, 2012 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 14, 2009
0
Date of Patent
October 2, 2012
0
Patent Application Number
12637485
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Patent Citations Received
Patent Inventor Names
Da-Jeng Yao
0
Yen-Chung Chang
0
Chang-Hsiao Chen
0
Shih-Chang Chuang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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