Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 8, 2013
Patent Application Number
12124043
Date Filed
May 20, 2008
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
An encapsulated MEMS device and a method to form an encapsulated MEMS device are described. An apparatus includes a first substrate having a silicon-germanium seal ring disposed thereon and a second substrate having a metal seal ring disposed thereon. The metal seal ring is aligned with and bonded to the silicon-germanium seal ring to provide a sealed cavity. A MEMS device is housed in the sealed cavity. A method includes forming a silicon-germanium seal ring on a first substrate and forming a metal seal ring on a second substrate. The metal seal ring is bonded to the silicon-germanium seal ring to provide a sealed cavity that houses a MEMS device.
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