Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shing-Chyang Pan0
Ching-Hua Hsieh0
Chung-Chi Ko0
Han-Hsin Kuo0
Date of Patent
January 29, 2013
Patent Application Number
12761805
Date Filed
April 16, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A copper interconnect includes a copper layer formed in a dielectric layer. A liner is formed between the copper layer and the dielectric layer. A barrier layer is formed at the boundary between the liner and the dielectric layer. The barrier layer is a metal oxide.
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