US Patent 8361900 Barrier layer for copper interconnect
Patent 8361900 was granted and assigned to Taiwan Semiconductor Manufacturing Company on January, 2013 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 16, 2010
Date of Patent
January 29, 2013
Patent Application Number
12761805
Patent Citations Received
Patent Inventor Names
Shing-Chyang Pan
0
Ching-Hua Hsieh
0
Chung-Chi Ko
0
Han-Hsin Kuo
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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