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US Patent 8524533 Room temperature metal direct bonding

Patent 8524533 was granted and assigned to Ziptronix on September, 2013 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

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Ziptronix

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8524533

Date of Patent

September 3, 2013

Patent Application Number

12913385

Date Filed

October 27, 2010

Patent Citations Received

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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same

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US Patent 12113054 Non-volatile dynamic random access memory

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US Patent 12125784 Interconnect structures

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US Patent 12132020 Low temperature bonded structures

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US Patent 11658173 Stacked dies and methods for forming bonded structures

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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics

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US Patent 11670615 Bonded structures

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US Patent 11694925 Diffusion barrier collar for interconnects

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Patent Primary Examiner

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James Mitchell

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