Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 15, 2014
Patent Application Number
13481630
Date Filed
May 25, 2012
Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
A multi-chip package comprises a first chip accommodated in a first housing and a second chip accommodated in a second housing. The first housing and the second housing are arranged in a laterally spaced-apart relationship defining a gap between the first housing and the second housing. An interconnecting structure is configured to span the gap and to electrically couple the first chip and the second chip.
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