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US Patent 8759964 Wafer level package structure and fabrication methods

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Mirng-Ji Lii0

Han-Ping Pu0

Date of Patent

June 24, 2014

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Patent Application Number

117791920

Date Filed

July 17, 2007

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Patent Citations Received

US Patent 12131984 Heterogeneous fan-out structure and method of manufacture

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US Patent 12119235 Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component

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US Patent 12119320 Chip package structure with bump

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US Patent 12125797 Package structure with fan-out feature

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US Patent 12125820 Through-dielectric vias for direct connection and method forming same

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US Patent 12132004 Semiconductor devices and methods of manufacture

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US Patent 11658085 Integrated circuit package and method

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US Patent 11670519 Redistribution structures for semiconductor packages and methods of forming the same

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