US Patent 8779600 Interlevel dielectric stack for interconnect structures

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

87796000

Patent Inventor Names

Thomas J. Haigh, Jr.0

Alfred Grill0

Griselda Bonilla0

Satyanarayana V. Nitta0

Son Van Nguyen0

Date of Patent

July 15, 2014

Patent Application Number

133440090

Date Filed

January 5, 2012

Patent Citations Received

‌

US Patent 11942426 Semiconductor structure having alternating selective metal and dielectric layers

‌

US Patent 11791398 Nano multilayer carbon-rich low-k spacer

Patent Primary Examiner

‌

Elias M Ullah

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