US Patent 8779600 Interlevel dielectric stack for interconnect structures
Is a
Date Filed
January 5, 2012
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Date of Patent
July 15, 2014
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Patent Application Number
13344009
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Patent Inventor Names
Thomas J. Haigh, Jr.
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Alfred Grill
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Griselda Bonilla
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Satyanarayana V. Nitta
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Son Van Nguyen
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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