Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Son Nguyen
Eric Miller
Richard A. Conti
Thomas J. Haigh, Jr.
Donald Canaperi
Date of Patent
October 17, 2023
Patent Application Number
17136169
Date Filed
December 29, 2020
Patent Citations
Patent Primary Examiner
Patent abstract
A method of making a semiconductor device includes forming a gate stack on a substrate. The method further includes depositing a first spacer layer on a sidewall of the gate stack. The first spacer layer includes silicon and carbon. The method includes performing a first nitrogen plasma treatment process on the first spacer layer to increase a density of the first spacer layer. The method further includes depositing a second spacer layer on the first spacer layer. The second spacer layer includes silicon, carbon, and nitrogen.
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