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US Patent 11791398 Nano multilayer carbon-rich low-k spacer

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

December 29, 2020

Date of Patent

October 17, 2023

Patent Application Number

17136169

Patent Citations

US Patent 8357608 Multi component dielectric layer

US Patent 8779600 Interlevel dielectric stack for interconnect structures

US Patent 9123727 Airgap interconnect with hood layer and method of forming

US Patent 9882022 Method for manufacturing transistor with SiCN/SiOCN multilayer spacer

US Patent 9768024 Multi-layer mask and method of forming same

US Patent 9935002 Conformal low temperature hermetic dielectric diffusion barriers

US Patent 7763979 Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof

US Patent 7879683 Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay

Patent Inventor Names

Son Nguyen

Eric Miller

Richard A. Conti

Thomas J. Haigh, Jr.

Donald Canaperi

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Thanhha S. Pham

CPC Code

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