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US Patent 8791575 Microelectronic elements having metallic pads overlying vias

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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate
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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
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US Patent 11935907 Image sensor device
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US Patent 11855064 Techniques for processing devices
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 08791575 Microelectronic elements having metallic pads overlying vias US Patent 8791575 Microelectronic elements having metallic pads overlying vias

Infobox
Patent Number
0879157500
Patent Number
879157500
Edits on 18 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=0879157500
Edits on 29 Apr, 2023
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
087915750
Date of Patent
July 29, 2014
0
Patent Application Number
128427170
Date Filed
July 23, 2010
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=087915750
Patent Primary Examiner
‌
Matthew Reames
0
Edits on 27 Sep, 2022
"Entity importer update"
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edited on 27 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
087915750
Date of Patent
July 29, 2014
0
Patent Application Number
128427170
Date Filed
July 23, 2010
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=087915750
Patent Primary Examiner
‌
Matthew Reames
0
Edits on 19 Jun, 2022
"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08791575
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created this topic on 24 Dec, 2021
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 US Patent 08791575 Microelectronic elements having metallic pads overlying vias

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08791575
Date of patent
July 29, 2014
Patent application number
12842717
Date Filed
July 23, 2010
Patent primary examiner
‌
Matthew Reames

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