US Patent 8847104 Wafer cutting method and a system thereof

Patent 8847104 was granted and assigned to Agency for Science, Technology and Research on September, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Agency for Science, Technology and Research

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8847104

Patent Inventor Names

Hongyu Zheng0

Zhongke Wang0

Tao Chen0

Date of Patent

September 30, 2014

Patent Application Number

13132835

Date Filed

December 4, 2009

Patent Citations Received

‌

US Patent 11890807 Systems and methods for controlling additive manufacturing processes

Patent Primary Examiner

‌

Hsien-Ming Lee

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