US Patent 8847104 Wafer cutting method and a system thereof
Patent 8847104 was granted and assigned to Agency for Science, Technology and Research on September, 2014 by the United States Patent and Trademark Office.
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Patent Citations Received
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Patent Inventor Names
Hongyu Zheng0
Tao Chen0
Zhongke Wang0
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US Patent 08847104 Wafer cutting method and a system thereof US Patent 8847104 Wafer cutting method and a system thereof
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Patent Number
08847104
Patent Number
8847104
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Official Website
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US Patent 08847104 Wafer cutting method and a system thereof
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Is a
Current assignee
Patent jurisdiction
Patent number
08847104
Date of patent
September 30, 2014
Patent application number
13132835
Date Filed
December 4, 2009
Patent primary examiner
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