US Patent 8847393 Vias between conductive layers to improve reliability

Patent 8847393 was granted and assigned to Freescale Semiconductor on September, 2014 by the United States Patent and Trademark Office.

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Puneet Sharma0

Tuan S. Hoang0

Date of Patent

September 30, 2014

Patent Application Number

130364610

Date Filed

February 28, 2011

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