US Patent 8847393 Vias between conductive layers to improve reliability
Patent 8847393 was granted and assigned to Freescale Semiconductor on September, 2014 by the United States Patent and Trademark Office.
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Patent Citations Received
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Patent Inventor Names
Puneet Sharma0
Tuan S. Hoang0
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US Patent 08847393 Vias between conductive layers to improve reliability US Patent 8847393 Vias between conductive layers to improve reliability
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Patent Number
088473930
Patent Number
88473930
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
088473930
Date of Patent
September 30, 2014
0Patent Application Number
130364610
Date Filed
February 28, 2011
0Official Website
Patent Primary Examiner
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US Patent 08847393 Vias between conductive layers to improve reliability
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08847393
Date of patent
September 30, 2014
Patent application number
13036461
Date Filed
February 28, 2011
Patent primary examiner
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