US Patent 8865527 Lid attach process

Patent 8865527 was granted and assigned to Advanced Micro Devices on October, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Advanced Micro Devices

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8865527

Patent Inventor Names

Janet Kirkland0

Maxat Touzelbaev0

Seah Sun Too0

Date of Patent

October 21, 2014

Patent Application Number

13952392

Date Filed

July 26, 2013

Patent Citations Received

‌

US Patent 11804468 Manufacturing method of semiconductor package using jig

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US Patent 11756855 Method of fabricating package structure

Patent Primary Examiner

‌

Yu-Hsi D Sun

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