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US Patent 8865527 Lid attach process

Patent 8865527 was granted and assigned to Advanced Micro Devices on October, 2014 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11804468 Manufacturing method of semiconductor package using jig
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"Add patent inventor(s)"
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Golden AI
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Patent Inventor Names
Janet Kirkland0
Maxat Touzelbaev0
Seah Sun Too0
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Golden AI
edited on 13 Sep, 2023
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Patent Citations Received
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US Patent 11756855 Method of fabricating package structure
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"Remove website redirecting to Patent Public Search front page"
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=08865527
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US Patent 08865527 Lid attach process US Patent 8865527 Lid attach process

Infobox
Patent Number
08865527
Patent Number
8865527
Edits on 15 Jun, 2022
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Golden AI
edited on 15 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08865527
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 US Patent 08865527 Lid attach process

Infobox
Is a
Patent
Patent
Current assignee
Advanced Micro Devices
Advanced Micro Devices
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08865527
Date of patent
October 21, 2014
Patent application number
13952392
Date Filed
July 26, 2013
Patent primary examiner
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Yu-Hsi D Sun

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