US Patent 8901736 Strength of micro-bump joints

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Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8901736

Patent Inventor Names

Chen-Shien Chen0

Chen-Cheng Kuo0

Ming-Fa Chen0

Rung-De Wang0

Wen-Wei Shen0

Date of Patent

December 2, 2014

Patent Application Number

12789696

Date Filed

May 28, 2010

Patent Citations Received

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US Patent 11913121 Fabrication method of substrate having electrical interconnection structures

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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

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US Patent 12068278 Processed stacked dies

Patent Primary Examiner

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Jae Lee

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