Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 8912670 Bumpless build-up layer package including an integrated heat spreader

Patent 8912670 was granted and assigned to Intel on December, 2014 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Applicant

Intel

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

89126700

Patent Inventor Names

Tannaz Harirchian0

Deepak Kulkarni0

John S. Guzek0

Weng Hong Teh0

Chia-Pin Chiu0

Date of Patent

December 16, 2014

Patent Application Number

136312050

Date Filed

September 28, 2012

Patent Citations Received

‌

US Patent 12113056 Stacked dies and methods for forming bonded structures

‌

US Patent 11764177 Bonded structure with interconnect structure

‌

US Patent 11935907 Image sensor device

‌

US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics

‌

US Patent 11984396 Localized high density substrate routing

‌

US Patent 12107042 Localized high density substrate routing

Patent Primary Examiner

‌

Nitin Parekh

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 8912670 Bumpless build-up layer package including an integrated heat spreader

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API