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US Patent 8912670 Bumpless build-up layer package including an integrated heat spreader

Patent 8912670 was granted and assigned to Intel on December, 2014 by the United States Patent and Trademark Office.

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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12107042 Localized high density substrate routing
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US Patent 11984396 Localized high density substrate routing
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US Patent 11935907 Image sensor device
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Patent Inventor Names
Chia-Pin Chiu0
Deepak Kulkarni0
John S. Guzek0
Tannaz Harirchian0
Weng Hong Teh0
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 08912670 Bumpless build-up layer package including an integrated heat spreader US Patent 8912670 Bumpless build-up layer package including an integrated heat spreader

Infobox
Patent Number
089126700
Patent Number
89126700
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=089126700
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Infobox
Is a
Patent
Patent
0
Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
089126700
Date of Patent
December 16, 2014
0
Patent Application Number
136312050
Date Filed
September 28, 2012
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=089126700
Patent Primary Examiner
‌
Nitin Parekh
0
Edits on 15 Jun, 2022
"Entity importer update"
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Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=08912670
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created this topic on 28 Dec, 2021
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 US Patent 08912670 Bumpless build-up layer package including an integrated heat spreader

Infobox
Is a
Patent
Patent
Patent applicant
Intel
Intel
Current assignee
Intel
Intel
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
08912670
Date of patent
December 16, 2014
Patent application number
13631205
Date Filed
September 28, 2012
Patent primary examiner
‌
Nitin Parekh

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