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US Patent 8952544 Semiconductor device and manufacturing method thereof

Patent 8952544 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2015 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Date Filed
July 3, 2013
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Date of Patent
February 10, 2015
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
13935167
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Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11862546 Package core assembly and fabrication methods
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11676832 Laser ablation system for package fabrication
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US Patent 11705365 Methods of micro-via formation for advanced packaging
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11837680 Substrate structuring methods
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Patent Inventor Names
Jui-Pin Hung
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Po-Hao Tsai
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Jing-Cheng Lin
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8952544
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Patent Primary Examiner
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Phuc Dang
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