Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 24, 2015
Patent Application Number
13029657
Date Filed
February 17, 2011
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A chip package includes a plurality of layers including conductive planes connected by vias. The layers include a first portion having an antenna formed therein and a parallel-plate mode suppression mechanism to suppress parallel-plate mode excitation of the antenna. The parallel-plate mode suppression mechanism includes a reflector offset from an antenna ground plane and first grounded vias. A second portion has an interface for connecting to an integrated circuit device wherein the first portion and the second portion are separated by the parallel-plate mode suppression mechanism.
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