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US Patent 8988299 Integrated antenna for RFIC package applications

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 17, 2011
Date of Patent
March 24, 2015
Patent Application Number
13029657
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
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US Patent 12113056 Stacked dies and methods for forming bonded structures
0
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US Patent 12125784 Interconnect structures
0
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US Patent 12132020 Low temperature bonded structures
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
0
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US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
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US Patent 11749645 TSV as pad
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US Patent 11756880 Interconnect structures
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US Patent 11760059 Method of room temperature covalent bonding
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US Patent 11764177 Bonded structure with interconnect structure
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8988299
Patent Primary Examiner
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Dameon E Levi

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