Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
September 22, 2015
0Patent Application Number
133537650
Date Filed
January 19, 2012
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.
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