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US Patent 9139423 Micro electro mechanical system structures

Patent 9139423 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2015 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 11841561 Silicon photonic device with backup light paths
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US Patent 11837517 Packaged semiconductor devices with wireless charging means
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Patent abstract

A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.

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US Patent 11776881 Semiconductor device and method
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US Patent 11767216 Semiconductor MEMS structure
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US Patent 09139423 Micro electro mechanical system structures US Patent 9139423 Micro electro mechanical system structures

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Patent Number
091394230
Patent Number
91394230
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=091394230
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Infobox
Is a
Patent
Patent
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
091394230
Date of Patent
September 22, 2015
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Patent Application Number
133537650
Date Filed
January 19, 2012
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=091394230
Patent Primary Examiner
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Joseph Schoenholtz
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=09139423
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 US Patent 09139423 Micro electro mechanical system structures

Infobox
Is a
Patent
Patent
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
09139423
Date of patent
September 22, 2015
Patent application number
13353765
Date Filed
January 19, 2012
Patent primary examiner
‌
Joseph Schoenholtz

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