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US Patent 9224704 Process for realizing a connecting structure

Patent 9224704 was granted and assigned to Soitec on December, 2015 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Soitec
Soitec
Date Filed
August 26, 2011
Date of Patent
December 29, 2015
Patent Application Number
13219099
Patent Citations Received
‌
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
‌
US Patent 12113054 Non-volatile dynamic random access memory
0
‌
US Patent 12125784 Interconnect structures
0
‌
US Patent 12132020 Low temperature bonded structures
0
‌
US Patent 11658173 Stacked dies and methods for forming bonded structures
0
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11670615 Bonded structures
0
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US Patent 11694925 Diffusion barrier collar for interconnects
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‌
US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
0
‌
US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9224704
Patent Primary Examiner
‌
Michael Jung

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