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US Patent 9240347 Tungsten feature fill

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
1
Date Filed
September 30, 2014
1
Date of Patent
January 19, 2016
1
Patent Application Number
14502817
1
Patent Citations Received
‌
US Patent 12104243 Methods and apparatus for processing a substrate
2
‌
US Patent 11895844 Semiconductor memory device
3
‌
US Patent 11972952 Atomic layer deposition on 3D NAND structures
4
‌
US Patent 11978666 Void free low stress fill
5
‌
US Patent 12002679 High step coverage tungsten deposition
6
‌
US Patent 12062545 Fluorine-free tungsten ALD for dielectric selectivity improvement
7
‌
US Patent 12077858 Tungsten deposition
8
Patent Inventor Names
Michal Danek
1
Raashina Humayun
1
Deqi Wang
1
Esther Jeng
1
Juwen Gao
1
Anand Chandrashekar
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
9240347
1
Patent Primary Examiner
Bradley K. Smith
Bradley K. Smith
1
Industry
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