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US Patent 9368866 Shielding module integrating antenna and integrated circuit component

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 15, 2013
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Date of Patent
June 14, 2016
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Patent Application Number
13942684
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
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US Patent 11715730 Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements
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US Patent 11749645 TSV as pad
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US Patent 11756880 Interconnect structures
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US Patent 11760059 Method of room temperature covalent bonding
•••
Patent Inventor Names
Ya Chung Yu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9368866
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Patent Primary Examiner
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Sue A. Purvis
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