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US Patent 9385078 Self aligned via in integrated circuit
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Patent
Date Filed
March 9, 2016
Date of Patent
July 5, 2016
Patent Application Number
15064688
Patent Citations Received
US Patent 11916013 Via interconnects including super vias
0
US Patent 12113013 Dual color via patterning
0
US Patent 11784120 Metal via structure
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9385078
Patent Primary Examiner
Douglas Menz
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