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US Patent 9394161 MEMS and CMOS integration with low-temperature bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 5, 2015
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Date of Patent
July 19, 2016
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Patent Application Number
14639492
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11670615 Bonded structures
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•••
Patent Inventor Names
Chia-Hua Chu
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Chun-Wen Cheng
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Jung-Huei Peng
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9394161
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Patent Primary Examiner
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Long Pham
0

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