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US Patent 9496239 Nitride-enriched oxide-to-oxide 3D wafer bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 11, 2015
Date of Patent
November 15, 2016
Patent Application Number
14967137
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12094849 Atomic layer deposition bonding layer for joining two semiconductor devices
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11658173 Stacked dies and methods for forming bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11670615 Bonded structures
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US Patent 11694925 Diffusion barrier collar for interconnects
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•••
Patent Inventor Names
Chih-Chao Yang
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Daniel C. Edelstein
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9496239
Patent Primary Examiner
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Roy Potter

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