Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 20, 2016
Patent Application Number
14960225
Date Filed
December 4, 2015
Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
An embodiment method for forming a semiconductor package includes attaching a first die to a first carrier, depositing a first isolation material around the first die, and after depositing the first isolation material, bonding a second die to the first die. Bonding the second die to the first die includes forming a dielectric-to-dielectric bond. The method further includes removing the first carrier and forming fan-out redistribution layers (RDLs) on an opposing side of the first die as the second die. The fan-out RDLs are electrically connected to the first die and the second die.
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