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US Patent 9530723 Semiconductor device and manufacturing method thereof

Patent 9530723 was granted and assigned to Renesas Electronics on December, 2016 by the United States Patent and Trademark Office.

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Patent abstract

On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

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