Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Colin Kenneth Campbell0
Robert James Ramm0
Alan David Tepe0
Dino Sasaridis0
Wenjun Liu0
Date of Patent
December 5, 2023
0Patent Application Number
179666140
Date Filed
October 14, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
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