Patent 11837523 was granted and assigned to Tesla, Inc. on December, 2023 by the United States Patent and Trademark Office.
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.