US Patent 9530723 Semiconductor device and manufacturing method thereof
Patent 9530723 was granted and assigned to Renesas Electronics on December, 2016 by the United States Patent and Trademark Office.
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Patent abstract
On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.
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Patent Inventor Names
Akira Muto0
Kazuhiro Mitamura0
Koji Bando0
Yukihiro Sato0
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US Patent 09530723 Semiconductor device and manufacturing method thereof US Patent 9530723 Semiconductor device and manufacturing method thereof
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Patent Number
095307230
Patent Number
95307230
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Official Website
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
095307230
Date of Patent
December 27, 2016
0Patent Application Number
148621020
Date Filed
September 22, 2015
0Official Website
Patent Primary Examiner
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US Patent 09530723 Semiconductor device and manufacturing method thereof
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09530723
Date of patent
December 27, 2016
Patent application number
14862102
Date Filed
September 22, 2015
Patent primary examiner
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