Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kunzhong Hu0
Kwan-Yu Lai0
Jun Zhai0
Date of Patent
January 31, 2017
0Patent Application Number
149353100
Date Filed
November 6, 2015
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Packages and 3D die stacking processes are described. In an embodiment, a package includes a second level die hybrid bonded to a first package level including a first level die encapsulated in an oxide layer, and a plurality of through oxide vias (TOVs) extending through the oxide layer. In an embodiment, the TOVs and the first level die have a height of about 20 microns or less.
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