Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kunzhong Hu0
Kwan-Yu Lai0
Jun Zhai0
Date of Patent
January 31, 2017
0Patent Application Number
149353100
Date Filed
November 6, 2015
0Patent Citations Received
0
0
0
0
...
Patent Primary Examiner
Patent abstract
Packages and 3D die stacking processes are described. In an embodiment, a package includes a second level die hybrid bonded to a first package level including a first level die encapsulated in an oxide layer, and a plurality of through oxide vias (TOVs) extending through the oxide layer. In an embodiment, the TOVs and the first level die have a height of about 20 microns or less.
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