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US Patent 9613861 Damascene wires with top via structures

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Patent Citations Received

US Patent 12062609 Electronic fuse structure embedded in top via

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US Patent 11961759 Interconnects having spacers for improved top via critical dimension and overlay tolerance

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US Patent 11923246 Via CD controllable top via structure

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US Patent 11894265 Top via with damascene line and via

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US Patent 11869808 Top via process with damascene metal

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US Patent 11854884 Fully aligned top vias

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Patent abstract

Damascene wires with top via structures and methods of manufacture are provided. The semiconductor structure includes a damascene wiring structure with an integrally formed top via structure in self-alignment with the damascene wiring structure which is underneath the integrally formed top via structure.

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Patent Citations Received

US Patent 11804406 Top via cut fill process for line extension reduction

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Patent Inventor Names

Brent A. Anderson0

Edward J. Nowak0

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US Patent 11709553 Automated prediction of a location of an object using machine learning

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US Patent 11682617 High aspect ratio vias for integrated circuits

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US Patent 11670542 Stepped top via for via resistance reduction

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=09613861

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US Patent 09613861 Damascene wires with top via structures US Patent 9613861 Damascene wires with top via structures

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Patent Number

09613861

Patent Number

9613861

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Website URL

https://pdfpiw.uspto.gov/.piw?Docid=09613861

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US Patent 09613861 Damascene wires with top via structures

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Is a

Patent jurisdiction

United States Patent and Trademark Office

Patent number

09613861

Date of patent

April 4, 2017

Patent application number

14818419

Date Filed

August 5, 2015

Patent primary examiner

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